High speed, high density direct mate orthogonal connector
US11817657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2022 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Aug 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6594
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.