Grinding material
US11819978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Mar 17, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plurality of types. Of the abrasive grains of the plurality of types, provided that first abrasive grains have the largest average diameter and second abrasive grains have the second largest average diameter, the percentage of the average diameter of the second abrasive grains with respect to that of the first abrasive grains is 5-70%. The total content of the abrasive grains in the grinding layer is preferably 50-85% by volume. The content of the first abrasive grains in the grinding layer is preferably 1-25% by volume. The first abrasive grains are preferably diamond abrasive grains and the second abrasive grains are preferably alumina abrasive grains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.