Mold positioning device
US11820060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | May 21, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76568
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is provided a structure for positioning a first mold part of a mold on a mold mounting face in an injection molding machine. The structure comprises a positioner configured to connect the first mold part to part of the injection molding machine, wherein the positioner is adjustable to position the first mold part on the mold mounting face. The structure further comprises controller executable instructions executable in a controller with which to resolve an alignment parameter of the mold using a feedback signal from a sensor. Further provided is a method of operating an injection molding machine which method comprises the steps of positioning a first mold part of a mold on a mold mounting face using a positioner and appreciating an alignment parameter of the mold with reference to a feedback signal from a sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.