Patent · US Active

Fused filament fabrication of high entropy alloys

US11820070B2 · kind B2 · utility

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12Claims
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Key dates

Filing dateNov 11, 2020
Grant dateNov 21, 2023
Priority date
Expiry dateApr 10, 2041

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

An additive manufacturing technique includes depositing, via a filament delivery device, a filament onto a surface of a substrate. The filament includes a binder and a high entropy alloy powder. The technique also includes sacrificing the binder to form a preform and sintering the preform to form a component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.