Fused filament fabrication of high entropy alloys
US11820070B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Nov 11, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Apr 10, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An additive manufacturing technique includes depositing, via a filament delivery device, a filament onto a surface of a substrate. The filament includes a binder and a high entropy alloy powder. The technique also includes sacrificing the binder to form a preform and sintering the preform to form a component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.