Conductive plating apparatus, plating system and plating method for conductive film
US11821100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2022 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Aug 19, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.