Temperature sensing device and method for a hot stamping die apparatus
US11821797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Dec 10, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K13/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.