Multi-array parallel optical links
US11822135B2 · kind B2 · utility
0Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2022 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | May 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.