System for inserting a wire into a semiconductor chip
US11822309B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Nov 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.