Patent · US Active

Method and device for treating substrates

US11823931B2 · kind B2 · utility

0Cited by

5References

3Claims

0Family size

Assignee

RENA Technologies GmbH · DE

Inventors

Stefan-Heinrich Hansen · Waldkirch, DE
Markus Uihlein · Glückstadt, DE
Bernd-Uwe Sander · Freiburg (Elbe), DE
Stephan Alexis Pediaditakis · Heuweiler, DE

Key dates

Filing date	Jan 27, 2022
Grant date	Nov 21, 2023
Priority date	—
Expiry date	Jan 27, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67706
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for detaching a liquid lamella from a substrate edge is provided. A tear-off front is configured at at least one point of the liquid lamella. A width of the liquid lamella is then reduced by guiding the tear-off front along the substrate edge. Thus, the width of the liquid lamella prior to being torn off the substrate edge can be reduced by at least 50%, as compared to an original width of the liquid lamella.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.