Microbolometer systems and methods
US11824078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jun 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/78
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.