Diode laser arrangement and method for producing a diode laser arrangement
US11824324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2019 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Sep 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A diode laser arrangement has a diode laser device and at least one cooling device. The at least one cooling device is arranged on the diode laser device. The at least one cooling device is configured to cool the diode laser device. The at least one cooling device has a contact body and at least one heat conducting insert. The contact body contains a first material or consisting of a first material, and the at least one heat conducting insert has a second material, which is different from the first material, or consisting of a second material, which is different from the first material, and the contact body is arranged on the diode laser device. The at least one heat conducting insert is embedded in the contact body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.