Component stack mounting structure and electronic device including same
US11825007B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/12
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device according to various embodiments may include a display, a main board, a component connector, a supporting member, and a sensor module. The main board is disposed under the display. The component connector is disposed on a surface of the main board. The supporting member is configured to surround at least two side surfaces of the component connector and is disposed on the surface of the main board. The sensor module includes a sensor that faces at least a portion of the component connector. The sensor module also includes a sensor substrate that is stacked with the sensor and attached to the supporting member. The sensor substrate may be separably connected to the supporting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.