Patent · US Active

Vibration module for placement on an eardrum

US11825273B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

Vibrosonic GmbH · DE

Inventors

Tobias Fritzsche · Ludwigshafen, DE
Daniela Wildenstein · Tübingen, DE

Key dates

Filing date	Jan 31, 2020
Grant date	Nov 21, 2023
Priority date	—
Expiry date	Jul 4, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04R17/00
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a vibration module for placing on an eardrum, which vibration module has a flat sound transducer and an eardrum contact mold for contacting the eardrum.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.