Semiconductor module
US11825591B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Aug 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.