Circuit card assembly (CCA) module thermal interface devices
US11825633B2 · kind B2 · utility
0Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2022 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Feb 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.