Encapsulated insulation with uniformly heated surfaces for use on spacecraft internal surfaces
US11827383B2 · kind B2 · utility
0Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2020 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Mar 24, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/50
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A surface heating device and related method includes a heater assembly having a layer of dielectric material, thermal insulation material positioned adjacent to the heater assembly, an encapsulation layer surrounding the thermal insulation material and connected to the heater assembly, and a controller configured to control power delivered to the heater assembly to activate the dielectric material to generate heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.