Organometallic tin compounds as EUV photoresist
US11827659B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Aug 19, 2022 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Aug 19, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0042
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present disclosure is related to organometallic sandwich and half-sandwich tin (bearing η5-C5—Sn π bond) compounds as extreme ultraviolet (EUV) photoresist. Organometallic sandwich di(cyclopentadienyl)tin dialkoxide represented by the chemical formula (η5-C5R5)2Sn(OR1)(OR2), or half-sandwich (cyclopentadienyl)tin triamide represented by the chemical formula (η5-C5R5)Sn(NR12)(NR22)(NR32) are described including the methods for preparation and purification, wherein R1, R2, R3 are independently H, linear or branched alkyl, alkenyl, alkynyl, or cycloalkyl group with 1 to 20 carbon atoms, or aryl group with 6-20 carbon atoms. Sandwich and half-sandwich groups comprise cyclopentadienyl (C5H5), or substituted cyclopentadienyl (η5-C5H4R, η5-C5H3R2, η5-C5H2R3, η5-C5HR4, or η5-C5R5). The solution compositions of organometallic sandwich and half-sandwich tin (bearing η5-C5—Sn π bond) compounds are suitable for EUV photoresists, and/or the precursors of EUV photoresists for radiation sensitive coating and forming nanoscale patterns through photolithography.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.