Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound
US11827741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/206
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound: E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2 Formula 1E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4 Formula 2In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.