Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing article
US11827742B2 · kind B2 · utility
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7References
18Claims
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Key dates
| Filing date | Aug 17, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Oct 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F99/00
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article: E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2 Formula 1E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2 Formula 2
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.