Colorless transparent copolyamide-imide films with high modulus and low coefficient of thermal expansion and preparation thereof
US11827749B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 7, 2020 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Nov 9, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.