Resin material and laminate
US11827766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2018 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Jan 31, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/016
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.