Resin composition and article made therefrom
US11827786B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | Dec 22, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.