Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor
US11827793B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/53
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a squarylium core including three or more (meth)acrylate groups and a shell surrounding the squarylium core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.