Patent · US Active

Sputtering system

US11827974B2 · kind B2 · utility

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11Claims

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Assignees

Inventors

Po-Lun Chen · Longbeilingcun, CN
Chun-Ta Chen · Taoyuan, TW
Tsung-Chen Chou · Lo Wu, CN
CHIN-YANG WU · Lo Wu, CN
Nai-Hau Shiue · Zhunan, TW

Key dates

Filing date	Dec 10, 2020
Grant date	Nov 28, 2023
Priority date	—
Expiry date	Aug 6, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3435
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A sputtering system is suitable for sputtering a surface to be sputtered having sections. Each section has a projection height. The sputtering system includes a supporting plate, a sputtering array, and a controller. The sputtering array is arranged on the supporting plate. The sputtering array includes sputtering units. Each section corresponds to at least one of the sputtering units. Each sputtering unit has a driving shaft and a target. The target faces the surface to be sputtered. The controller is electrically connected the driving shaft. The driving shaft drives the target to move relative to the surface to be sputtered. The controller controls a distance between each sputtering unit and the corresponding section of the sections in the direction of the projection height to satisfy a given condition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.