Film formation method
US11827985B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Aug 6, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF01L2303/01
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A film forming method forms a coating film on a workpiece (e.g., a cylinder head) having a film-deposited portion (e.g., an annular valve seat part) by moving a nozzle of a cold spray device relative to the workpiece along a film formation trajectory having a film formation starting point and a film formation finishing point in which the film-deposited portion overlaps to form an overlapping portion. The coating film is formed by causing a raw material powder to collide in a solid-phase state with the workpiece and plastically deform. Also, the coating film on the film-deposited portion is further formed such that an inclination angle of an end part of the coating film relative to a surface of the film-deposited portion is 45° or less at the film formation starting point of the overlapping portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.