Test apparatus for semiconductor chips with fine-pitch bumps
US11828792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2020 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test apparatus for devices having fine pitches, includes a loading picker provided on one side of a loading part so as to sequentially adsorb devices to be tested, thereby putting the adsorbed devices on the upper surface of a vacuum chuck, a device alignment part, which is provided at an upper portion of a loading zone for aligning the devices, tester for testing a performance of the devices for a set time as the vacuum chuck positioned in the test position moves and comes into electrical contact with bumps of respective devices, and an unloading picker, which is provided at one side of an unloading zone so as to adsorb tested devices from the vacuum chuck, sorts the tested devices into good products and bad products, and unloads the tested devices as sorted on a tray of an unloading part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.