Magnetic field sensor integrated circuit with integral ferromagnetic material
US11828819B2 · kind B2 · utility
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309References
21Claims
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Assignee
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Key dates
| Filing date | Oct 13, 2022 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Oct 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.