Dimming substrate, manufacturing method thereof, dimming structure and dimming module
US11828965B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1337
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides a dimming substrate, a manufacturing method of the dimming substrate, a dimming structure and a dimming module, and relates to the technical field of display. According to the present disclosure, a bonding layer, a flexible base plate, an electrode layer and an orientation layer are sequentially arranged on a rigid carrier plate, and the bonding layer includes one or more adhesive layers. By removing flexible base films from the bonding layer, the bonding layer only includes one or more adhesive layers, such that the dimming substrate includes less flexible base films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.