Semiconductor die failure recovery in a data storage device
US11829270B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Nov 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2212/7208
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for a die kill and recovery sequence for a non-volatile memory (NVM). Data are stored in the NVM as data sets in garbage collection units (GCUs) that span multiple semiconductor dies. A die failure management circuit is configured to detect a die failure event associated with a selected die, and to generate a recovery strategy to accommodate the detected die failure event by selecting recovery actions to be taken in a selected sequence to maintain a current level of data transfer performance with a client device. The selected recovery actions are carried out in the selected sequence to transfer at least a portion of the user data stored in the selected die to a new replacement die, after which the selected die is decommissioned from further use. The NVM may be a flash memory of a solid-state drive (SSD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.