Multi-lender loan application management system
US11830065B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2022 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | May 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L67/63
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
In one aspect, the present disclosure relates to a multi-lender loan management system comprising an external network gateway, an internal network gateway, a messaging service, a plurality of Application Programming Interface (API) modules coupled between the external network gateway and the internal network gateway, and a plurality of micro services coupled to the internal network gateway and configured to communicate with each other via the messaging service. API modules can include a client API module and a lender API module. Microservices can include a loan applications microservice and an offers microservice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.