Package comprising integrated devices and bridge coupling top sides of integrated devices
US11830819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a first bridge and a second bridge. The first bridge is coupled to the first integrated device and the second integrated device. The first bridge is configured to provide at least one first electrical path between the first integrated device and the second integrated device. The first bridge is coupled to a top portion of the first integrated device and a top portion of the second integrated device. The second bridge is coupled to the first integrated device and the second integrated device. The second bridge is configured to provide at least one second electrical path between the first integrated device and the second integrated device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.