Heated pins to couple with solder elements
US11830846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2019 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.