Piezoelectric MEMS microphone
US11832057B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2022 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Dec 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.