Information handling system interchangeable solder pads
US11832393B2 · kind B2 · utility
0Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2022 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Jun 21, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.