Apparatus and method for encapsulating an electronic component
US11832398B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Oct 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.