CMP polishing pad with polishing elements on supports
US11833638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2020 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Jul 9, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad useful in chemical mechanical polishing can comprise a base pad having a top surface and surface, a plurality of polishing elements each having a top polishing surface and a bottom surface, and wherein each of the plurality of polishing elements is connected to the top surface of the base pad to the polishing element by three or more supports wherein the bottom surface of the polishing element, the top surface of the base pad and the supports define a region comprising at least one void and there are openings between the three or more supports. Such pad can be used in a method by providing a substrate and polishing the substrate with the pad, optionally, with a polishing medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.