Method and apparatus for forming three-dimensional curved surface on laminated substrate, and three-dimensional curved laminated substrate
US11833800B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2018 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | May 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/208
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for forming a three-dimensional curved surface on a laminated substrate is provided. In the method, the laminated substrate is brought into close contact with an elastic sheet. Here, the laminated substrate comprises a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin. The elastic sheet is deformed while the laminated substrate is in close contact with the elastic sheet. The laminated substrate is brought into close contact with a temperature-controlled mold to soften the resin substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.