Adhesive composition for semiconductor circuit connection and adhesive film including the same
US11834415B2 · kind B2 · utility
0Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Aug 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.