Adhesive compositions and their use in 3D printing
US11834590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2018 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Jan 11, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/1802
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive compositions comprising an aqueous dispersion of an acrylic polymer are disclosed, with such compositions having particular applicability in additive manufacturing processes, such as three-dimensional (3D) printing, including Fused Filament Fabrication (FFF). In particular, the compositions address drawbacks associated with an improper degree of adhesion between a thermoplastic build material and build plate, which decrease the quality of printed objects. In representative aqueous dispersions, the solids content of at least about 5 wt. % and also most about 95 wt. % of the acrylic polymer is solubilized, with the balance of this polymer comprising dispersed solid particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.