Thermosetting starch adhesive for wood-based panel and preparation method therefor
US11834591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Apr 18, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2451/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure discloses a thermosetting starch adhesive for a wood-based panel and a preparation method therefor, and belongs to the technical field of preparation of adhesives. In the present disclosure, starch is used as a main raw material, and after acid hydrolysis thereof, a semi-continuous seed emulsion polymerization method is adopted to improve control of monomer polymerization stability. After grafting is completed, a cross-linking monomer with polymerizable double bonds and condensable methylol functional groups is added for copolymerization. The cross-linking monomer is also added in a semi-continuous manner. After the cross-linking reaction is completed, the reaction mixture is gelatinized and incubated, and finally a thermosetting adhesive which can be used for bonding of hot-pressed wood-based panels is obtained. The adhesive of the present disclosure has the properties of two-step cross-linking and high-temperature rapid cross-linking curing, good film formation, good heat resistance, and strong cohesion. With a hot-pressing process in an appropriate coating manner, appropriate temperature and pressure, the resultant wood-based panels have all their properti…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.