Patent · US Active

Dielectric copolymer materials

US11834598B2 · kind B2 · utility

0Cited by

3References

23Claims

0Family size

Assignee

Merck Patent GmbH · DE

Inventors

Gregor Larbig · Gelnhausen, DE
Pawel Miskiewicz · Southampton, GB
Frank Meyer · Mannheim, DE
Joerg Pahnke · Darmstadt, DE
Karsten Koppe · Marl, DE

Key dates

Filing date	Oct 15, 2019
Grant date	Dec 5, 2023
Priority date	—
Expiry date	Oct 15, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09K2219/03
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.