Packaging for microLEDs for chip to chip communication
US11835758B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Nov 28, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Nov 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.