Artificial intelligence layer-based process extraction for robotic process automation
US11836626B2 · kind B2 · utility
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6References
21Claims
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Key dates
| Filing date | Nov 1, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Nov 1, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06Q10/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Artificial intelligence (AI) layer-based process extraction for robotic process automation (RPA) is disclosed. Data collected by RPA robots and/or other sources may be analyzed to identify patterns that can be used to suggest or automatically generate RPA workflows. These AI layers may be used to recognize patterns of user or business system processes contained therein. Each AI layer may “sense” different characteristics in the data and be used individually or in concert with other AI layers to suggest RPA workflows.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.