Substrate, printing apparatus, and manufacturing method
US11837301B2 · kind B2 · utility
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1References
11Claims
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Assignee
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Key dates
| Filing date | Mar 3, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Mar 25, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C17/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A substrate includes a plurality of memory units each including an anti-fuse element and a switching element configured to switch application of a predetermined voltage to the anti-fuse element, a wiring to which the plurality of memory units are connected, a first electrode pad to which a voltage for supplying the predetermined voltage to the wiring is applied, and a second electrode pad to which a voltage for supplying the predetermined voltage to the wiring is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.