Semiconductor device
US11837497B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Sep 10, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/215
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, including a plurality of protrusions; a plurality of fins formed over the substrate and aligned with the plurality of protrusions; and an isolation structure formed on the substrate and between the protrusions and the fins. An orthographic projection of each of the plurality of fins and an orthographic projection of a corresponding protrusion of the plurality of protrusions on the substrate coincide with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.