Localized targeted thermoelectric cooling thermal control of integrated circuits with sub-device scale resolution
US11837524B2 · kind B2 · utility
0Cited by
5References
12Claims
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Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device for integrated circuits. The device includes: a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device; and a single power connector that provides power to all the cells in the array. The controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.