Patent · US Active

Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewith

US11837525B1 · kind B1 · utility

0Cited by

1References

15Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Harald Kobolla · Seukendorf, DE
Marco Lederer · Hirschaid, DE
Rainer Popp · Petersaurach, DE

Key dates

Filing date	Jun 28, 2023
Grant date	Dec 5, 2023
Priority date	—
Expiry date	Jun 28, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L25/072
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.