Light emitting device package
US11837570B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the second bonding part. Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.