Method for manufacturing optoelectric semiconductor component and optoelectric semiconductor component device

US11837844B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• John Brückner · Santa Monica, US
• Urs Heine · Regensburg, DE
• Sven Gerhard · Alteglofsheim, DE
• Lars NÄHLE · Bad Abbach, DE
• Andreas Löffler · Neutraubling, DE
• André Somers · Obertraubling, DE

Key dates

• Filing date: Dec 27, 2018
• Grant date: Dec 5, 2023
• Expiry date: Jul 1, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/22
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for singulating semiconductor components (20) is specified, said method comprising the steps of providing a carrier (21), applying at least two semiconductor chips (22) on the carrier (21), etching at least one break nucleus (23) at a side of the carrier (21) facing the semiconductor chips (22), and singulating at least two semiconductor components (20) by breaking the carrier (21) along the at least one break nucleus (23). The at least one break nucleus (23) extends at least in places in a vertical direction (z), the vertical direction (z) being perpendicular to a main extension plane of the carrier (21), and the at least one break nucleus (23) is arranged between the two semiconductor chips (22) in a lateral direction (x), the lateral direction (x) being parallel to the main extension plane of the carrier (21). Further, each of the semiconductor components (20) comprises at least one of the semiconductor chips (22), and the expansion of the at least one break nucleus (23) in the vertical direction (z) is at least 1% of the expansion of the carrier (21) in the vertical direction (z). Furthermore, a semiconductor component (20) is specified.