MEMS microphone
US11838724B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Apr 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a MEMS microphone including a printed circuit board, a shell assembled with the printed circuit board for forming a receiving space and provided with a sound hole communicating with the receiving space, a MEMS Die with a cavity accommodated in the receiving space and mounted on the shell for covering the sound hole, and an ASIC chip accommodated in the receiving space and mounted on the shell through a substrate. The cavity of the MEMS Die communicates with the sound hole. The MEMS Die electrically connects with the ASIC chip. The ASIC chip electrically connects with the substrate. The substrate electrically connects with the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.